In brief it is a pcb producing methodology that spreads decoupled capacitance by inserting them in tiny dielectric layers inside the pcb and next to the power areas. This technology is also known as buried capacitance. 2 mil 50 µm dielectric thickness in different material types 4103 13 4105 6 is 410 p 96 370 turbo megtron zbc 2000 is the most commercially accepted material in the market more than 12 years of experience in processing and long term reliability history glass reinforced for improved rigidity.
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